27th ACM International Systems and Software Product Line Conference (SPLC 2023). Proceedings - Volume B
Arcaini P., Ter Beek M. H., Perrouin G., Reinhartz-Berger I., Machado I., Vergilio S. R., Rabiser R., Yue T., Devroey X., Pinto M., Washizaki H.
Software product lines
Welcome to SPLC'23, the 27th ACM International Systems and Software Product Line Conference. Looking back to the previous SPLC issues, the conference has been established as a thriving ground for practitioners, researchers, and educators working in areas related to systems and software product lines. With the increasing size and complexity of software, efficiently supporting software processes becomes an extremely important task. SPLC'23 acted as a venue fostering knowledge exchange and learning about the state of the art in software product lines aswell as newpractices, trends, innovations, insights from industrial applications, and new challenges. SPLC'23 was held at Hitotsubashi Hall in Tokyo, Japan, from August 28 to September 1, 2023.
Source: New York: ACM Press, 2023
Metrics
Back to previous page
@inproceedings{oai:it.cnr:prodotti:485806,
title = {27th ACM International Systems and Software Product Line Conference (SPLC 2023). Proceedings - Volume B},
author = {Arcaini P. and Ter Beek M. H. and Perrouin G. and Reinhartz-Berger I. and Machado I. and Vergilio S. R. and Rabiser R. and Yue T. and Devroey X. and Pinto M. and Washizaki H.},
doi = {10.1145/3579028},
booktitle = {New York: ACM Press, 2023},
year = {2023}
}
0000-0002-2930-6367ISTI Repository
DOIAlso available from
