27th ACM International Systems and Software Product Line Conference (SPLC 2023). Proceedings - Volume A
Arcaini P., Ter Beek M. H., Perrouin G., Reinhartz-Berger I., Luaces M. R., Schwanninger C., Ali S., Varshosaz M., Gargantini A., Gnesi S., Lochau M., Semini L., Washizaki H.
Software product lines
Welcome to SPLC'23, the 27th ACM International Systems and Software Product Line Conference. Looking back to the previous SPLC issues, the conference has been established as a thriving ground for practitioners, researchers, and educators working in areas related to systems and software product lines. With the increasing size and complexity of software, efficiently supporting software processes becomes an extremely important task. SPLC'23 acted as a venue fostering knowledge exchange and learning about the state of the art in software product lines aswell as newpractices, trends, innovations, insights from industrial applications, and new challenges. SPLC'23 was held at Hitotsubashi Hall in Tokyo, Japan, from August 28 to September 1, 2023.
Source: New York: ACM Press, 2023
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@inproceedings{oai:it.cnr:prodotti:485805,
title = {27th ACM International Systems and Software Product Line Conference (SPLC 2023). Proceedings - Volume A},
author = {Arcaini P. and Ter Beek M. H. and Perrouin G. and Reinhartz-Berger I. and Luaces M. R. and Schwanninger C. and Ali S. and Varshosaz M. and Gargantini A. and Gnesi S. and Lochau M. and Semini L. and Washizaki H.},
doi = {10.1145/3579027},
booktitle = {New York: ACM Press, 2023},
year = {2023}
}
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