Thermal vulnerability detection in integrated electronic and photonic circuits using infrared thermography
Hussain B., Jalil B., Pascali M. A., Imran M., Serafino G., Moroni D., Ghelfi P.
Photonic circuits Applied Physics (physics.app-ph) and Optics FOS: Physical sciences I.4 Atomic and Molecular Physics Computer Vision and Pattern Recognition (cs.CV) Electrical and Electronic Engineering FOS: Computer and information sciences Infrared imaging Engineering (miscellaneous) Physics - Applied Physics Computer Science - Computer Vision and Pattern Recognition
Failure prediction of any electrical/optical component is crucial for estimating its operating life. Using high temperature operating life (HTOL) tests, it is possible to model the failure mechanisms for integrated circuits. Conventional HTOL standards are not suitable for operating life prediction of photonic components owing to their functional dependence on the thermo-optic effect. This work presents an infrared (IR)-assisted thermal vulnerability detection technique suitable for photonic as well as electronic components. By accurately mapping the thermal profile of an integrated circuit under a stress condition, it is possible to precisely locate the heat center for predicting the long-term operational failures within the device under test. For the first time, the reliability testing is extended to a fully functional microwave photonic system using conventional IR thermography. By applying image fusion using affine transformation on multimodal acquisition, it was demonstrated that by comparing the IR profile and GDSII layout, it is possible to accurately locate the heat centers along with spatial information on the type of component. Multiple IR profiles of optical as well as electrical components/circuits were acquired and mapped onto the layout files. In order to ascertain the degree of effectiveness of the proposed technique, IR profiles of complementary metal-oxide semiconductor RF and digital circuits were also analyzed. The presented technique offers a reliable automated identification of heat spots within a circuit/system.
Source: Applied optics (2004, Online) 59 (2020): E97–E106. doi:10.1364/AO.389960
Publisher: Optical Society of America,, [New York] , Stati Uniti d'America
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Figure 15: Photograph (visible range) of commercial Arduino board (size = 6.86cm x 5.33cm). MC: Micro-controller, SPI: Serial-Parallel Interface
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@article{oai:it.cnr:prodotti:423676,
title = {Thermal vulnerability detection in integrated electronic and photonic circuits using infrared thermography},
author = {Hussain B. and Jalil B. and Pascali M. A. and Imran M. and Serafino G. and Moroni D. and Ghelfi P.},
publisher = {Optical Society of America,, [New York] , Stati Uniti d'America},
doi = {10.1364/ao.389960 and 10.48550/arxiv.2006.12201},
journal = {Applied optics (2004, Online)},
volume = {59},
year = {2020}
}
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10.1364/ao.389960
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