Smart Cities: parking monitoring through smart cameras

Leone G. R., Moroni D., Pieri G.

Smart cities  Urban traffic  Processing nodes  Parking monitoring  Automatic management  Free parking areas  Integrated management  Intelligent camera  Wireless smart cameras  Low-cost nodes  Video stream  Local public transport  Wireless sensor networks  Public outdoor parking areas  Traffic control  Cameras  Parking space  Global events  Monitoring  Economic crisis 

One of today's major problems in medium to large cities is pollution caused by urban traffic. There are various factors that negatively affect this problem. First of all, the constant increase in vehicles, and at the same time the reduction, for budget reasons, of the number of free parking areas more or less easily reached. Moreover, due to global events such as the economic crisis, there is a general reduction in the efficiency of local public transport. In this research, we present an approach to this problem that exploits the greater availability of IT structures and devices. The solution presented offers the possibility of improving one of the most burdensome aspects, namely the traffic generated by cars looking for a parking space through an integrated and automatic management of employment levels. The procedure is based on wireless smart cameras for monitoring public outdoor parking areas. The main strengths of this solution lie in the independence and scalability of the proposed architecture. Independence is ensured by the node's modus operandi, in which processing is performed on board the intelligent camera without the need for a video stream or operator intervention. Scalability can be achieved by designing low-cost nodes that can be connected in a sensor network that does not require high installation costs. Moreover, the possibility of making such processing nodes autonomous through the use of a photovoltaic panel allows them to be installed in even more flimsy situations.

Source: ICC Workshops 2019 - IEEE International Conference on Communications, pp. 1–6, Shanghai, China, 20-24 May, 2019

Publisher: IEEE, New York, USA

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